by The memory packaging market involves various processes and technologies that are utilized for the encapsulation and protection of integrated circuits and semiconductor chips. Memory packaging protects chips from ambient, thermal, and mechanical stresses and allows high-density mounting on printed circuit boards. It maximizes signal integrity and chip performance while minimizing cost. With the exponential growth in consumer electronics such as smartphones, tablets, smartwatches, digital cameras, and others, there is high demand for advanced memory chips and semiconductors with higher processing power, storage capacity, and efficiency. This is driving innovation in memory and semiconductor packaging technologies. Important types of memory packaging include ball grid array, surface-mounted technology, chip-scale packaging, and flip chip.
The global Memory Packaging Market is estimated to be valued at US$ 28.08 Bn in 2023 and is expected to exhibit a CAGR of 7.3% over the forecast period 2023 to 2030, as highlighted in a new report published by Coherent Market Insights.
Market key trends:
One of the important trends in the memory packaging market is the advancement of 3D integrated circuit (3D IC) packaging technology. 3D IC allows stacking of silicon wafers or chips together vertically to form a single device with multiple silicon layers connected through short vertical interconnects called through-silicon vias (TSVs). This innovative packaging technology significantly improves space utilization and performance by shortening interconnects’ lengths between silicon layers. Companies are developing advanced 3D IC packaging technologies utilizing TSVs to support growing demand for smaller, thinner, and more powerful devices driven by IoT and artificial intelligence. Leading players are also focusing on developing new metal organic compounds suitable for memory packaging applications.
Porter’s Analysis
Threat of new entrants: Low costs of entry and high R&D costs prevent new entrants from easily entering the memory packaging market.
Bargaining power of buyers: Memory packaging is an integral part of most electronic devices, giving buyers some bargaining power over suppliers.
Bargaining power of suppliers: A few large players dominate the supply of memory packaging materials and equipment, giving them strong bargaining power over buyers.
Threat of new substitutes: No close substitutes exist for memory packaging at present which package memory chips needed in devices.
Competitive rivalry: Competition is intense as the top players aggressively compete against each other on the basis of technology, quality, and pricing.
Key Takeaways
The Global Memory Packaging Market Demand is expected to witness high growth over the forecast period. APAC region holds the largest market share in the memory packaging market. Within APAC, China, Japan, South Korea and Taiwan are some of the major markets for memory packaging. This is attributed to growing semiconductor manufacturing in these countries along with a significant presence of memory chip and device manufacturers.
Regional analysis- The APAC region is expected to hold the largest share of the memory packaging market during the forecast period due to the existence of several memory chip and semiconductor manufacturing companies in major countries like China, South Korea, Taiwan, and Japan. These countries are also a major hub for electronics, smartphone, and computer manufacturing.
Key players operating in the memory packaging are Tianshui Huatian Technology Co Ltd, Hana Micron Inc., lingsen precision industries Ltd, Formosa Advanced Technologies Co. Ltd (FATC), Advanced Semiconductor Engineering Inc. (ASE Inc.), Amkor Technology Inc., Jiangsu Changjiang Electronics Technology Co. Ltd, Powertech Technology, King Yuan Electronics Corp. Ltd, ChipMOS Technologies Inc., TongFu Microelectronics Co., and Signetics Corporation. Key players are focused on new product development and adopting innovative packaging solutions to cater to the growing demand for miniaturization and high-density memory packaging
*Note:
1. Source: Coherent Market Insights, Public sources, Desk research
2. We have leveraged AI tools to mine information and compile it
